Thursday, July 29, 2010

Latest Development Press Releases

VIA Launches AMOS-5000 Series Device Development Kits, Adds Modular Convenience to Fanless Em-ITX

Technology Releases - Development

VIA brings greater expediency and versatility to fanless embedded PC design with modular expansion board and chassis development kits

Read more: VIA Launches AMOS-5000 Series Device Development Kits, Adds Modular Convenience to Fanless Em-ITX

 

VIA Takes Advanced 64-Bit Computing to the Factory Floor

Technology Releases - Development

VIA EPIA-M840 Mini-ITX board brings the VIA Nano E-Series processor to intelligent industrial applications

Tags:

Read more: VIA Takes Advanced 64-Bit Computing to the Factory Floor

   

Progress Software Introduces a New Generation Apama Capital Markets Foundation

Technology Releases - Development

Progress Software Corporation (NASDAQ: PRGS), a leading software provider that enables enterprises to be operationally responsive, today announced the launch and immediate availability of a new generation of its Progress® Apama® Capital Markets Foundation. The Apama Capital Markets Foundation builds on the award-winning Apama Complex Event Processing platform by providing a powerful set of pre-built capabilities for developers creating a broad range of capital markets trading applications.

Read more: Progress Software Introduces a New Generation Apama Capital Markets Foundation

   

StarChip announces the successful tape-out of its 32bit-Secure Chip SIM platform based on Cortus APS3 processor.

Technology Releases - Development

StarChip, high volume, secure microcontroller design expert, announces the tape-out of its 32bit-Secure chip SIM platform. This new technology includes Flash secure 32-bit SIM architecture based on Cortus APS3S core and providing high-level endurance management, fast personalization mode and fully secure lifecycle handling.

Read more: StarChip announces the successful tape-out of its 32bit-Secure Chip SIM platform based on Cortus APS3 processor.

   

VIA EITX-3001 Shows that ‘Thin is In’ for Embedded Devices

Technology Releases - Development

VIA announce VIA EITX-3001, a slim-line Em-ITX form factor board featuring VIA Nano E-Series and HD video over HDMI

Read more: VIA EITX-3001 Shows that ‘Thin is In’ for Embedded Devices

   

The hunt is on to discover the technology tycoons of tomorrow

Technology Releases - Development

Discovering Start-Ups 2010 - stimulating and enabling technology innovation

Read more: The hunt is on to discover the technology tycoons of tomorrow

   

RIM Announces Initiatives to Support Innovation in the Australian Mobile Industry

Technology Releases - Development

Australian Developers Encouraged to Rise to Super Apps Developer Challenge – APAC Division

Read more: RIM Announces Initiatives to Support Innovation in the Australian Mobile Industry

   

ASUS Covers all the Multimedia Bases at Computex 2010

Technology Releases - Development

EeeTop PC ET 24", Blu-ray 3D Optical Disc Drive, VG236H 3D LCD Monitor and O!Play HD2 Media Player Headline Showcase of Latest Multimedia Innovations

Read more: ASUS Covers all the Multimedia Bases at Computex 2010

   

Intel Expands 2010 Intel® Core™ Processor Family to Stylish Ultra-Thin Laptops

Technology Releases - Development

Intel Corporation introduced new Intel® Core™ processors today, extending the availability of its award-winning Intel Core processor family to more stylish, ultra-thin laptops. Ultraportable laptops – less than an inch thick and weighing just 2 to 5 pounds – offer the performance, battery life and connectivity consumers need on-the-go.

Read more: Intel Expands 2010 Intel® Core™ Processor Family to Stylish Ultra-Thin Laptops

   

VSIDE - VSDSP Integrated Development Environment

Technology Releases - Development

VLSI Solution has today announced VSIDE - the Integrated Development Environment for VSDSP Processor Family.

Read more: VSIDE - VSDSP Integrated Development Environment

   

Baolab creates nanoscale MEMS inside the CMOS wafer

Technology Releases - Development

Uses standard CMOS technologies and lines to slash MEMS costs by up to two thirds

Read more: Baolab creates nanoscale MEMS inside the CMOS wafer

   

Page 1 of 4